Key Features:  

Wide Protocol Coverage : Includes popular protocols such as UART , SPI, 12C, CAN (optional),and LAN, as well as advanced protocols like Ethernet, Modbus and Zigbee for wireless Communication.

Hands-on Learning Modules: Practical Exercises and Experiments focus on protocol configuration, timing analysis, and data packet inspection.

Specifications:

ATmega328P Development Board (System on Module)

Specification:

a. RISC Architecture

b. 2 KB SRAM

c. 32 KB Flash Memory

d. 16 MHz CPU speed

e. Type B USB Connector

f. Inbuilt ADC

g. Embedded Protocol: I2C | SPI | UART

h. Operational Temperature: -40°C to +125°C

i. Source/Sink Current: 20mA

j. 5v Operational Voltage

k. Inbuilt USART module

l. 16 MHz Internal Oscillator

On- Board wireless Chipset & Module Interface

2 LoRa : SX1276 RFM95W (System on Module)

a. LoRa Modem.

b. Communication: SPI

c. 168 dB maximum link budget.

d. +20 dBm – 100 mW constant RF output vs. V supply.

e. +14 dBm high efficiency PA.

f. Programmable bit rate up to 300 kbps.

g. High sensitivity: down to -148 dBm.

h. FSK, GFSK, MSK, GMSK, LoRaTM and OOK modulation.

i. 127 dB Dynamic Range RSSI.

j. Automatic RF Sense and CAD with ultra-fast AFC.

k. Packet engine up to 256 bytes with CRC.

l. Module Size：16*16mm On board

m. Inbuilt Power Distribution

n. Male Header Pinout for Interfacing

o. Spiral Soldered Antenna IN865-867Mhz

p. UFL Connector for External Antenna 

1 4G GSM : Simcom A7670C (System on Module)

1. Power supply VBAT: 3.4V ~4.2V

2. Power saving Current in sleep mode :<2.5mA

3. Data Transmission Throughput

a) GPRS multi-slot class 12

b) EDGE multi-slot class 12

c) LTE-FDD CAT1：10 Mbps (DL)，5 Mbps (UL)

d) LTE-TDD CAT1 ：8.96Mbps (DL)，3.1 Mbps (UL)

e) GSM/LTE Main antenna interface

4. SMS

a) MT,MO, CB, Text , PDU mode

b) Short Message(SMS) storage device: USIM Card, CB does not support saving in SIM Card Support CS domain and PS domain SMS

c) USIM interface Support identity card: 1.8V/ 3V

d) USIM application support SAT class 3, GSM 11.14 Release 98 Support USAT

e) Support phonebook types : SM/FD/ON/AP/SDN

f) Audio feature:

a. PCM Digital Audio interface

b. Analog audio MIC input interface(A7670C-LAAS support only)

c. Analog audio SPK output interface(LAAS support only)

2 Bluetooth Module:

1. Voltage Rating (VDC): 3.6 to 6

2. Switch/Button Yes

3. Input Supply Voltage (V) 3.6 ~ 6

4. Input current (mA) 50

5. Max. Operating Range (m): 10

6. Operating Frequency (Hz): 2.4GHz ISM band

7. Modulation Type GFSK (Gaussian Frequency Shift Keying)

8. Emission power 4dBm, Class 2

9. Sensitivity (dBm) -84dBm at 0.1% BER

1 Bluetooth Low Energy Module :

1. Bluetooth Version: 4

2. Voltage Rating (VDC): 5

3. Input Supply Voltage (V) 5

4. USB Protocol USB V2.0

5. Operating Frequency (Hz): 2.4GHz ISM band

6. Modulation Mode GFSK

7. Transmitting Power (dBm) ≤4

8. Coverage Range (m) 60

9. Sensitivity (dBm) ≤-84dBm at 0.1% BER

2 Zigbee XBee Module:

1. Model Type XBee Pro S2C, Zigbee Board/Module

2. Antenna (Y/N): Yes

3. Frequency (GHz): 2.4

4. Receive Current (mA): 28

5. RF Standard: 802.15.4

6. Digital I/O: 15

7. ADC Channels : (4) 10-bit ADC inputs

8. Data Transfer Rate : RF 250 Kbps

9. RATED INDOOR/URBAN RANGE : 200 ft (60 m)

10. RATED OUTDOOR : 4000 ft (1200 m)

11. Transmit Power (dBm) : 3.1mW (+5 dBm)

12. Channels : 16

13. Encryption : 128-bit AES

14. Input Supply Voltage (VDC) : 2.1 ~ 3.6

15. TRANSMIT CURRENT : 33 mA

Communication Mode : CMOS UART, SPI

7. WiFi Module :

1. 802.11 b/g/n

2. Wi-Fi Direct (P2P), soft-AP

3. Integrated TCP/IP protocol stack

4. Integrated TR switch, balun, LNA, power amplifier and matching network

5. Integrated PLLs, regulators, DCXO and power management units

6. Power down leakage current of <10uA

7. 1MB Flash Memory

8. SDIO 1.1 / 2.0, SPI, UART

9. STBC, 1×1 MIMO, 2×1 MIMO

10. A-MPDU & A-MSDU aggregation & 0.4ms guard interval

On- Board wired Module Interface

1. RS485 Module (System on Module)

a. On-board MAX485 chip, A low power consumption for the RS-485 communication, slew-rate limited transceiver.

b. A low power consumption for the RS-485 communication

c. On-board compact size board

d. Suitable for use with most microcontrollers

e. Inbuilt Power Distribution

f. Male Header Pinout for Interfacing

2. MAX3232 Module (System on Module)

a. Operating Voltage: 3.3-5.5V

b. It can be used to program STC MCU, NXP MCU, Renesas MCU, STM32 MCU, N -2EC MCU

c. On-board compact size board

d. Suitable for use with most microcontrollers

e. Operates up to 250 kbit/s

f. Inbuilt Power Distribution

g. Male Header Pinout for Interfacing

On- Board Sensors & Actuators

RED, GREEN, BLUE LED – (1Nos EACH – On-Board)

Mounting Style SMD/SMT

Package: 5050

Forward Current: 20 mA

Forward Voltage: 2.05 V, 2.6 V, 2.85 V

Male Header Pinout for Interfacing

User Push Button– (3Nos – On-Board)

SPST

Through-hole

Shaft Shape: Round

Male Header Pinout for Interfacing

Relay – (1Nos – On-Board)

Relay Contact Current Capacity at AC250V: 10A

Relay Contact Current Capacity at DC5V: 10A

SPDT PCB Mount Relay

Male Header Pinout for Interfacing

Buzzer – (1Nos – On-Board)

Input Voltage(Max.) : 5V

Resistance: 42 Ω

Resonance Frequency: 2048 Hz

Male Header Pinout for Interfacing

Temperature and Humidity Sensor Module – (1Nos – System on Module)

Power Supply： 3.3~5.5V DC

Output： 4 pin single row

Measurement Range： Humidity 20-90%RH， Temperature 0~50℃

Accuracy： Humidity +-5%RH， Temperature +-2℃

Resolution： Humidity 1%RH， Temperature 1℃

Interchangeability： Fully Interchangeable

Long-Term Stability： <±1%RH/year

Male Header Pinout for Interfacing

Ultrasonic Sensor

Sensor Type: Ultrasonic

Output: Digital Sensor

Voltage: 5VDC

TFT Display :

1. Display Size: 1.8″

2. Driver IC: ST7735

3. Input Voltage (V): 3.3 to 5

4. Pixel Resolution: 128 x 160

5. PCB Size (mm): 57×34 (LxW)

6. Interface Type: SPI

Accessories along with the IOT KIT:

1. Cables for Microcontrollers (Type B & Micro USB)

2. Jumper Wires (F-F)

3. Power Adaptor 5v 3A