MCU Specifications:
• CPU: Xtensa dual-core 32-bit LX6 microprocessor, up to 240MHz
• ROM: 448KB for booting and core functions
• SRAM: 520KB for booting and instructions
• SRAM: 16 KB in RTC
• SPI Flash: 4MB
• Ultra-Low Power (ULP) Co-processor
• Crystal oscillator: 40 MHz
• 8x Hybrid Digital IO with Special Functions
• Special Functions: 1x I2C, 1x SPI, 1x UART
• 4x Hybrid Analog & Digital IO: 4 No’s
• 2x Hybrid Analog & Digital IN: 2 No’s
• Analog Resolution: 8,10,12-bit configurable
• Pulse Width Modulation (PWM)
• Onboard Temperature Sensing (typ., -40°C to 90°C with Accuracy 0.3 °C)
• Onboard Humidity Sensing (typ., 0%RH to 100%RH with Accuracy 2%RH)
• Onboard LED: 1xRED
• Baud rate configurable
• 802.11 b/g/n Wi-Fi
• Bluetooth Classic and Bluetooth Low Energy (BLE) in the 2.4GHz band
• General ISM < 1GHz LoRa™ Transceiver 868MHz Surface Mount
• Onboard Antenna for Wi-fi & Bluetooth
• Open source software
LoRa Specification:
• LoRa Chip: RF96
• Data Rate: 300kbps
• Power Output: 20dBm
• Sensitivity: -148dBm
• Current Transmitting: 120mA
• Operating Temperature: -20°C ~ 70°C
• RF Family/Standard: General ISM < 1GHz
• Protocol: LoRa™
• Modulation: FSK, GFSK, GMSK, MSK, OOK
• Frequency: 865-867 MHz
• Antenna Type - External Antenna via SMA / I-Pex connector
• Supply Voltage: 1.8V ~ 3.7V
• Receiving Current: 12.1mA
• Transmitting Current: 120mA
• Operating Temperature: -20°C ~ 70°C
Wi-Fi:
• 802.11b/g/n
• Bit rate: 802.11n up to 150 Mbps
• A-MPDU and A-MSDU aggregation
• 0.4 µs guard interval support
• Center frequency range of operating channel: 2412 ~ 2484 MHz
Bluetooth Specification:
• Bluetooth v4.2 BR/EDR and BLE specification
• Class-1, class-2 and class-3 transmitter
• Adaptive Frequency Hopping (AFH)
Common DC Characteristics:
• Supply Voltage: 5 V
• Operating Voltage: 3.0 - 3.6 V
• Minimum current delivered by power supply: 500 mA
• Battery Voltage: 3.7 V Li-Poly
• operating temperature range: – 40 °C ~ 85 °C
• Wake up from GPIO interrupt, timer, ADC measurements
Applications:
• Home Automation
• Smart Building
• Industrial Automation
• Smart Agriculture
MCU Specifications:
• CPU: Xtensa dual-core 32-bit LX6 microprocessor, up to 240MHz
• ROM: 448KB for booting and core functions
• SRAM: 520KB for booting and instructions
• SRAM: 16 KB in RTC
• SPI Flash: 4MB
• Ultra-Low Power (ULP) Co-processor
• Crystal oscillator: 40 MHz
• 8x Hybrid Digital IO with Special Functions
• Special Functions: 1x I2C, 1x SPI, 1x UART
• 4x Hybrid Analog & Digital IO: 4 No’s
• 2x Hybrid Analog & Digital IN: 2 No’s
• Analog Resolution: 8,10,12-bit configurable
• Pulse Width Modulation (PWM)
• Onboard Temperature Sensing (typ., -40°C to 90°C with Accuracy 0.3 °C)
• Onboard Humidity Sensing (typ., 0%RH to 100%RH with Accuracy 2%RH)
• Onboard LED: 1xRED
• Baud rate configurable
• 802.11 b/g/n Wi-Fi
• Bluetooth Classic and Bluetooth Low Energy (BLE) in the 2.4GHz band
• General ISM < 1GHz LoRa™ Transceiver 868MHz Surface Mount
• Onboard Antenna for Wi-fi & Bluetooth
• Open source software
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